Prime Minister Narendra Modi is set to participate in an event, ‘India’s Techade: Chips for Viksit Bharat ‘ on March 13th marking a pivotal moment in India’s technological advancement. Scheduled for 10:30 AM, the event will be conducted via video conferencing, allowing widespread participation across the nation.
The centerpiece of the event will be the laying of the foundation stone for three semiconductor projects, collectively valued at approximately Rs 1.25 lakh crore. These projects are aligned with the Prime Minister’s vision to position India as a global leader in semiconductor design, manufacturing, and technology development, thereby creating ample employment opportunities for the country’s youth.
The projects include the establishment of a Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) in Gujarat, an Outsourced Semiconductor Assembly and Test (OSAT) facility in Morigaon, Assam, and another OSAT facility in Sanand, Gujarat.
The Semiconductor fabrication facility at DSIR will be spearheaded by Tata Electronics Private Limited (TEPL), representing a monumental investment of over Rs. 91,000 crore. This facility, the first of its kind in India, will play a crucial role in bolstering the country’s semiconductor industry.
Additionally, TEPL will also oversee the establishment of the OSAT facility in Morigaon, Assam, with an investment of approximately Rs 27,000 crore. Another OSAT facility in Sanand, Gujarat, will be set up by CG Power and Industrial Solutions Limited, with an investment of about Rs 7,500 crore. These facilities are being developed under the Modified Scheme for Semiconductor Assembly, Testing, Marking, and Packaging (ATMP).