The Union Cabinet, chaired by Prime Minister Narendra Modi, on Tuesday approved four additional semiconductor manufacturing projects under the India Semiconductor Mission (ISM), marking a significant boost to the country’s semiconductor ecosystem.
With six projects already underway, the four new approvals bring the total to ten semiconductor initiatives with cumulative investments of approximately Rs. 1.60 lakh crore across six states. These projects are expected to create over 2,000 skilled jobs directly and generate many more indirect employment opportunities.
The new projects come from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. They will establish semiconductor manufacturing units in Odisha, Punjab, and Andhra Pradesh, addressing growing demands across telecom, automotive, data centres, consumer electronics, and industrial sectors.
SiCSem Private Limited, in collaboration with Clas-SiC Wafer Fab Ltd. from the UK, will set up the country’s first commercial Silicon Carbide (SiC) compound semiconductor fab in Bhubaneswar’s Info Valley, Odisha. The facility will have an annual capacity of 60,000 wafers and 96 million packaging units, producing devices for defense, electric vehicles, railways, data centres, consumer appliances, and solar power inverters.
3D Glass Solutions Inc. will also establish a vertically integrated advanced packaging and embedded glass substrate unit in Bhubaneswar, featuring cutting-edge packaging technology including 3D Heterogeneous Integration modules. The facility will cater to defense, high-performance computing, AI, automotive, and photonics industries with an annual capacity of 69,600 glass panel substrates and 50 million assembled units.
ASIP Technologies will launch a semiconductor manufacturing unit in Andhra Pradesh in partnership with APACT Co. Ltd, South Korea. The plant will produce 96 million units annually for mobile phones, set-top boxes, automobile electronics, and other consumer products.
Continental Device India Private Limited will expand its existing discrete semiconductor plant in Mohali, Punjab. The brownfield expansion will manufacture high-power devices like MOSFETs, IGBTs, Schottky diodes, and transistors using Silicon and Silicon Carbide, producing 158 million units per year for EVs, renewable energy, power conversion, and communication infrastructure.
These projects complement India’s growing chip design capabilities supported by government initiatives benefiting 278 academic institutions and 72 startups, along with talent development programs training over 60,000 students to meet industry needs.