India and the United States on Tuesday signed a major framework agreement aimed at strengthening cooperation in the mining, processing and supply of critical minerals and rare earths, marking a significant step in deepening strategic and economic ties between the two countries.
The Framework on “Securing of Supply in the Mining and Processing of Critical Minerals and Rare Earths” was signed in New Delhi by External Affairs Minister S. Jaishankar and US Secretary of State Marco Rubio.
The Ministry of External Affairs (MEA) said that the Framework aims to deepen India-U.S. cooperation across the critical minerals and rare earths supply chain, including mining, processing, recycling and related investments. It seeks to strengthen resilient and diversified supply chains, while promoting collaboration in financing and effective management of critical minerals and rare earths scrap.
The MEA seid that the signing of the Framework marks an important milestone in advancing the vision articulated by Prime Minister Narendra Modi and President Donald J. Trump during the Prime Minister’s visit to Washington, D.C. in February 2025. The India – U.S. Joint Statement issued during the visit had underlined the strategic importance of critical minerals for emerging technologies and advanced manufacturing, and recognised secure and resilient supply chains for critical minerals as a shared strategic priority of both countries.
The MEA added that the framework builds on continuing India – U.S. cooperation aimed at strengthening supply chain security in critical sectors. On 20 February 2026, India became a signatory to the U.S. – led Pax Silica initiative. India also signed a Joint Statement on the “India-U.S. AI Opportunity Partnership” as a bilateral addendum to the Declaration.
Earlier, EAM Jaishankar had also participated in the Foreign Ministers’ Meeting on critical minerals hosted by Rubio in Washington, D.C. on February 4. India and the US are also partnering under the Forum on Resource Geostrategic Engagement (FORGE) initiative.
