May 29, 2026 3:22 PM
Odisha govt signs semiconductor substrate manufacturing pact with Intel, 3DGS: Ashwini Vaishnaw
The Odisha government has signed a memorandum of understanding (MoU) with Intel and 3D Glass Solutions (3DGS) to bring substrate manufacturing technology to India, according to Union Minister for Electronics and Information Technology Ashwini Vaishna...




